| 摘要 |
PURPOSE:To incorporate a soldering process in IC manufacturing processes, by dropping paste shaped solder on a part, where the electrode on a substrate is overlapped with the pin of a lead frame, and fusing the solder with a hot air jet. CONSTITUTION:A pin 21 of a lead frame 2 is overlapped on an electrode 11 of a substrate 1. Under this state, the substrate 1 and the lead frame 2 are intermittently moved and stopped. At every time of stop, paste shaped solder 42 is dropped by a specified amount around the pin 21 from a solder supplying cylinder 4. When the part, on which the solder 42 is dropped, is positioned at a part under a heater nozzle 5, hot air 56 is jetted from the nozzle 5 and the solder 42 is heated and fused. The fused solder 42 is separated from the nozzle 5 when the substrate 1 and the lead frame 2 are sent to the direction of an arrow A. The solder is cooled and the electrode 11 of the substrate 1 and the pin 21 of the lead frame 2 are fixed. |
