| 摘要 |
PURPOSE:To dispense with a driving gear and to simplify the vacuum seal of a wafer as well as to enable to improve the higher-reliability and higher-maintenability of the titled wafer pushing-up device by a method wherein the wafer pushing-up device, which has a wafer placing surface at one end thereof and whose other end surface has been constituted of a heat-elastic material provided abuttingly against a fixing surface having a cooling function and a heater affixed to the heat elastic material, is provided. CONSTITUTION:A hole 24 having a bottom surface, which is used as a fixing surface, is bored in the wafer placing position of a table 10 from the surface of the table 10 and a wafer pushing-up device; which has a wafer placing surface at one end thereof and whose other end surface has been constituted of a heat elastic material abutting on the bottom surface of the hole 24, such as a heat elastic material 25 made with a configuration memory alloy, and a heater 26 affixed windingly to the heat elastic material 25; is internalized in the hole 24 in such a way as to be guided its expansion and contraction by a guide 27. One end of an electric wire 29 provided insertedly in a hole 28 bored interpenetratively in the hole 24 from one end side of the table 10 is connected to the heater 26. |
