| 摘要 |
PURPOSE:To prevent the breakage of a surface acoustic wave element during or after its processing by forming plural rectilinear scribing grooves on the rear surface side of a single crystal wafer of LiTaO3 which is cut at a (2-1-10) face and in the direction excepting the cleaving direction. CONSTITUTION:A wafer 1 has a main face of (2-1-10) and the cleaving faces (1-102), (-1012) and (01-12) cross each other on said main face. The cross line between the main face (2-1-10) and faces (1-102) and (-1012) forms the 1st cleaving line 2; while the 2nd cleaving line 3 is formed with the cross line between the face (2-1-10) and the face (01-12). In addition, an orientation flat 4 is formed at an end part of the wafer 1 and the surface acoustic wave is transmitted toward the flat 4. Then grid-shaped grooves 5 are formed by scribing with high density so as to obtain the maximum angle to the lines 2 and 3. For the directions of these grooves 5, the direction [01-10] is turned toward the direction [0001] of the shortest revolving angle by an angle phi1 or phi2. |
