| 摘要 |
<p>Heat-resistant resin moldings having excellent abrasion resistance, surface smoothness, solvent resistance, durability, and adhesiveness to base material, which comprises a resin molding composed of at least 2 wt% of a structural unit represented by formula (I), (wherein R represents a hydrogen atom or a C1 to C20 alkyl, aryl or alicyclic group) and at most 98 wt% of an ethylenic monomer unit having provided thereon a hardened film of a crosslinkable resin material containing at least 30 wt% of at least one monomer having three or more (meth)acryloyloxy groups per molecule, and a process for their production are disclosed.</p> |
