发明名称 LAMINATE MOLDING METHOD OF METAL LINED LAMINATED BOARD
摘要 PURPOSE:To equalize heat conduction from a hot plate in a upper section and a lower section by setting the thermal conductivity of a cushion material on the side, toward which a metallic foil is directed, to a value smaller than that of a cushion material on the other side. CONSTITUTION:Metallic foils 1 are set to one surfaces on one sides of prepregs 2 between hot plates 4 and 5 under the state in which the metallic foils are superposed so as to be upward directed, paired and held among plates 3 made of a metal. Cushion materials 6, 7 are inserted previously on the lower side of the hot plate 4 and the upper side of the hot plate 5. The cushion material 6 on the upper side is formed by a material, thermal conductivity thereof is more inferior than another cushion material 7. The cushion material 6 on the upper side is slower than another cushion material in the velocity of heat conduction from the hot plates 4, 5 on heating and pressure-molding. Since the metallic foil 1 is directed upward, however, the thermal conductivity of the prepreg in an upper section is faster than that of the prepreg in a lower section. Accordingly, both actions offset each other, and the velocity of heat conduction to the prepregs 2 from the hot plates 4, 5 is equalized approximately.
申请公布号 JPS60166428(A) 申请公布日期 1985.08.29
申请号 JP19840023622 申请日期 1984.02.10
申请人 MATSUSHITA DENKO KK 发明人 NARUSE TETSUROU;FUJIMOTO YASUHIRO
分类号 B32B15/08;B29C65/70;B29K105/22;B29L9/00;H05K3/02 主分类号 B32B15/08
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