发明名称 MANUFACTURE OF RESIN-MOLDED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To commonly use a mold by using the mold having a plurality of cavities, and supplying molten resin only corresponding cavities even for lead frames of different types. CONSTITUTION:When a frame 19s is disposed at the prescribed position of a lower mold 10, interposed between the lower mold 10 and an upper mold 11, and a valve 17 is opened in case of the SEP-shaped lead frame 19s, molten resin is supplied to all cavities through a pot 12, a runner 13 and a gate 14 to seal the resin 20. When lead groups secured with elements are disposed at every other cavities with n=1 in case of DIP-shaped lead frames 19d disposed at an interval that the interval of the leads is N (N=n+1, n=1,2...) times with respect to the interval of the cavities, the molten resin is supplied only to the corresponding cavities, and sealed at 20. According to this configuration, the injection mold can be commonly used.
申请公布号 JPS60165730(A) 申请公布日期 1985.08.28
申请号 JP19840022096 申请日期 1984.02.08
申请人 SANYO DENKI KK;TOKYO SANYO DENKI KK 发明人 TAMURA HIROSHI
分类号 H01L23/50;H01L21/56 主分类号 H01L23/50
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