| 摘要 |
<p>In a circuit assembly a plurality of devices (16, Fig. 3) are disposed on a common laminar carrier 11 and are covered with a layer 17, 20 of an insulating material. Metallised interconnect tracks 21, 22 are provided on the layer 17, 20 between the devices. Photodiodes and amplifiers, or passive devices, can be packaged on an electrically conducting or insulating carrier 11, for flip clip mounting on a pcb, or mounting in a ceramic package. <IMAGE></p> |
