Process for producing semiconductor wafers

摘要

The invention relates to a process for producing silicon wafers from silicon rods (1), in which the silicon rod (1) is first provided on its lateral face with an at least partially circumferential notch (7) in a (111) plane. A thermal-shock treatment is then applied, in which inhomogeneous heating and cooling of the silicon rod (1) takes place, a silicon wafer (8) being cleaved off the silicon rod (1) as a result. <IMAGE>