发明名称 |
Single package epoxy resin system |
摘要 |
A curing agent for one package epoxy resin systems is disclosed as a imidazole blocked naphthyl diisocyanate which, when incorporated in epoxy resins, has an extended shelf life and can be cured by exposure to relatively low temperatures. The curing agent is insoluble in epoxy resins that are liquid at room temperature and is useful in connection therewith.
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申请公布号 |
US4533715(A) |
申请公布日期 |
1985.08.06 |
申请号 |
US19830530106 |
申请日期 |
1983.09.07 |
申请人 |
HEXCEL CORPORATION |
发明人 |
LEE, FRANK W. C.;BARON, KENNETH S. |
分类号 |
C08G18/00;C08G18/58;C08G18/76;C08G18/80;(IPC1-7):C08G18/81;C08G18/28 |
主分类号 |
C08G18/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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