LIQUID COOLING TYPE HIGH-FREQUENCY SOLID STATE DEVICE

摘要

PURPOSE:To cool a solid state element to be cooled excellently without varying high frequency characteristics by housing said solid state element in a package and bringing a substrate section for the package into contact with a cooling liquid. CONSTITUTION:The inside of a sealed vessel 2 with radiator fins 3a is filled with a cooling liquid 2 such as Freon, and a high-frequency solid circuit device 4 on which a flat package type solid state element part 6 is loaded is dipped in the cooling liquid. The solid state element part 6 is constituted in such a manner that a solid state element 14 such as a transistor is loaded on a substrate 11 and the periphery of the solid state element is sealed hermetically by a package 12 consisting of a metal of ceramics while interposing space. The solid state element part 6 is disposed so that the package 12 is buried in the recessed section of a metallic carrier 18 for the device 4 and the back of the substrate 11 is directed as an upper surface. The heat generation of the solid state element 14 is dissipated into the cooling liquid 2 through the substrate 11.