| 摘要 |
PURPOSE:To improve productivity by a method wherein, after the position of bonding of a lead corresponding with a previously obtained pad position is detected by use of a detecting camera, wire bonding is performed, and in the course of this work, the bonding position of the next lead is detected and stored by use of the detecting camera. CONSTITUTION:An XY-table 16 for a camera 15 for detecting the position of bonding bonding is installed on an XY-table 12; a lead frame 1 mounting an IC element 2 is set as a bonding sample 17 and positioned on a bonding stage. According to the coordinates of a standard position stored in a storage 18, the table 16 is operated; the camera 15 detects the coordinate reference point on the element 2, and obtains the coordinates of a pad 3 position. At this time point, first bonding becomes possible, and wire bonding is started. The camera 15 precedes during the bonding, sets a detection mark of the next lead 4 as a reference, and detects and stores the bonding position of each lead 4 corresponding to each pad position by using the table 16. Thereby workability is improved, and high speed automation can be realized. |
