| 摘要 |
A soldering foil having a multi-layer structure for the stress-free joining of ceramic bodies to metal is described along with a process for making the foil. The soldering foil contains two layers of an active solder, particularly a Cu/Ti solder, provided with an intermediate cushion layer, preferably of copper, which absorbs the stresses. Between the copper cushion layer and the active solder layers barrier layers of silver are arranged which are very thin in relation to the copper and solder layers. The soldering foil permits a low-stress and extremely durable connection to be established between metal and ceramic, simultaneously permitting relatively large deviations in the temperature and time parameters of the soldering process. |
