| 摘要 |
PURPOSE:To perform wire bonding a lead to an IC rapidly and with high precision by reciprocally moving a bonding tool only in the vertical Z direction while relatively moving and rotating the IC with respect to the tool only by means of an IC holding mechanism. CONSTITUTION:Arms 19 and 20 havina pawls arranged at equal spaces are moved in X and Y directions synchronously so that carriers 15 are intermittently transferred at regular intervals along guide paths 17 and 18 provided with sliding rails 15 and 26. The carrier 15C is fixed on a holding mechanism 16 and the rail 25 is retreated while the arm 19 is raised and retreated. Deflections DELTAX, DELTAY and DELTAtheta of an IC22 are detected with a camera 7 and calculated based on the coordinates previously stored. An X table 10, a Y table 12 and a rotary table 14 are operated and a capillary 5 is lowered along the Z axis so that a lead terminal is bonded to a pad. After completing the bonding, the holding mechanism 16 is returned to its neutral position, and the rails are projected while the arms are moved rectangularly so as to locate the next carrier 15D on the holding mechanism 16. According to this constitution, the rapid responding ability and the accuracy of the XY table can be improved so that the reliability of the bonding can be improved. |
