Method for interconnecting close lead center integrated circuit packages to boards

摘要

The invention is a method for interconnecting close lead center integrated circuit package to boards by forming the leads as follows: (1) bonding the lead frame material to a thin insulating film, and the (2) forming the leads. Next, the film base is removed selectively where connections to the package and board will be made. The lead material is then plated and formed to provide stress relief in the package-to-board interconnect. The lead frame is then attached to the package and board.