| 摘要 |
PURPOSE:To enable to cut down the manufacturing cost of the titled device in an automation of the mounting process of the device and to realize a plane mounting by a method wherein a radiating fin, a part of which has been made to expose, is provided on the mounting face of the wiring substrate of an enclosure; the exposed part of the radiating fin is made to adhere on the wiring substrate formed in a radiator structure; and the heat radiation is performed. CONSTITUTION:A radiating fin 16 is bend-formed in a shape corresponding to those of lead pins 12, 12..., and at the same time, a thick part 16a is formed for enabling a part of the mounting face of the printing substrate (wiring substrate) 17 of an enclosure 11 to expose from the enclosure 11. At the mounting time of this sealed semiconductor device, the lead pins 12, 12... are placed on the bonding region of the printing substrate 17 and are soldered, and at the same time, the bonding parts of the radiating fin 16 are soldered to radiator-structure parts formed on the substrate 17. Moreover, the exposing face of the substrate 17, where is exposing from the enclosure 11 and contacts to the thick part 16a of the radiating fin 16, is formed in a radiator structure, and the thick part 16a and the exposing face of the substrate 17 formed in a radiator structure are mutually made to adhere. Accordingly, the heat radiation is performed from the bonding parts of the radiating fin 16 and the exposing face of the substrate 17, where is exposing from the enclosure 11. |
