发明名称 |
Soldering apparatus |
摘要 |
Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided with an array of molten solder overflowing ports arranged in a direction transverse to the travelling path is moveable in the same direction so as to form the progressive wave of molten solder.
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申请公布号 |
US4530458(A) |
申请公布日期 |
1985.07.23 |
申请号 |
US19830561981 |
申请日期 |
1983.12.16 |
申请人 |
NIHON DEN-NETSU KEIKI CO., LTD |
发明人 |
KONDO, KENSHI |
分类号 |
B23K3/06;(IPC1-7):B23K1/08 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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