| 摘要 |
PURPOSE:To eliminate coating of radiation shielding material by sealing a semiconductor element assembling structure in which a plate made of a material having a radiation generating amount smaller than a molding resin is bonded to the main surface of a semiconductor element with the resin. CONSTITUTION:A plate 7 formed of a material having a radiation generating amount smaller than a molding resin 6 is bonded with an adhesive 8 onto a main surface of a semiconductor element 1. As a result, radiation shielding effect is enhanced by the plate which can be readily selected in its thickness and which can be formed in thickness so as not to disturb the reduction in the thickness of a package. Since the thickness of the resin can be sufficiently increased, mechanical strength and moisture resistance are not lost. |
