RESIN SEALING APPARATUS FOR SEMICONDUCTOR ELEMENT

摘要

PURPOSE:To make it feasible to control the molding pressure easier with high precision subject to easier maintenance by a method wherein a shifting platen is driven by an AC servomotor while the motor is controlled to detect a relative position of the shifting platen and a top force so that the relative position may coincide with the relative position corresponding to the specified molding pressure. CONSTITUTION:A relative position detector 40 detecting the relative position of a top force 14 and a shifting platen 13 is composed of a rotary encoder 42 comprising a rack 41 fixed to the shifting platen 13, a gear 44 driven by the shifting rack 41 and a pinion 42a engaged with the gear 44 while the rotary encoder 42 is fixed to a stay 43 mounted on a lower platen 11. In such a constitution, a drive controller 50 receiving output signals from the rotary encoder 42 to control the AC servomotor 16 drives the motor 16 so that the relative position of the top force 14 and the shifting platen 13 may coincide with the specified position.