| 摘要 |
PURPOSE:To avoid the concentration of the pressure of water vapor on a boundary part at the time of reflow of solder, by providing a gentle gradient at the boundary part of the end part of an element forming surface, i.e., a surface (side surface), which is perpendicular to the thickness direction of a semiconductor chip and the element forming surface. CONSTITUTION:A step correcting body 15 comprises a silicone resin. A boundary part (a) having about a right angle, which is formed by a surface 12b that is perpendicular to the thickness direction of a semiconductor chip 12 and an element forming surface 12a, is concealed by said silicone resin 15. Namely, the step correcting body 15 comprising the silicone resin is closely contacted with the boundary (a) of the surface 12a of the semiconductor chip 12. Thus, a surface part 15a of the silicone resin 15 and the surface 12a of the semiconductor chip 12 are coupled. The surface 12a and the surface part 15a of the resin 15 are terminated as a continuous surface having a gentle gradient toward a chip mounting part 13a without stepped parts. |
