发明名称 LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the manufacture of LED lamps of different directivity by a method wherein the burial depth is made variable by constructing tie-bars in a plurality in a lead frame with cathode leads coupled with anode leads by means of tie-bars. CONSTITUTION:In the lead frame with the cathode frame 2 joined to the anode frame 3 by means of the first tie-bar 4, and with a light emitting diode 5 mounted at the frame tip, a plurality of tie-bars 71 and 72 are provided in parallel with the above-mentioned first tie-bar 4. These tie-bars are controlled in the burial depth by being supported by a guide 12 formed on the case mold 11 at the time of resin molding by insertion of the lead frame to the case mold 11. In other words, the case of the guide 12 being supported by the uppermost tie-bar 72 yields deepest burial, and the case of being supported by the lowermost tie- bar 71 yields shallowest burial.
申请公布号 JPS60133768(A) 申请公布日期 1985.07.16
申请号 JP19830241374 申请日期 1983.12.21
申请人 TOSHIBA KK 发明人 SUGIO TOSHIHIKO
分类号 H01L23/48;H01L31/02;H01L33/62 主分类号 H01L23/48
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