发明名称 DIAMOND HEAT SINK
摘要 PURPOSE:To obtain a low cost diamond heat sink which has a high performance by providing metal films insulated from each other on the upper and lower surfaces of a synthetic diamond. CONSTITUTION:Metal films 3, 3 insulated from each other are provided on the upper and lower surfaces of a synthetic diamond 4. As the diamond 4 that having, for example, thermal conductivity of 12watt/cm deg.C or higher under room temperature is used. For instance, 0.5 carat or diamond one synthesized by a temperature difference process is cut, polished, and a thin plate of approx. 4mm./5mmX0.3mm. is formed. A flat plate which has 0.3mm. thick is pickled and degreased with an organic solvent, titanium Ti is coated in a thickness of 500Angstrom on the upper and lower surfaces by ion plating, and gold Au is further coated in a thickness of 1.5mm.. Then, a diamond of thin plate is cut by a laser light in a square shape of 0.80X0.80mm. to obtain a heat sink.
申请公布号 JPS60127750(A) 申请公布日期 1985.07.08
申请号 JP19830237093 申请日期 1983.12.14
申请人 SUMITOMO DENKI KOGYO KK 发明人 SATOU SHIYUUICHI;YATSU SHIYUUJI
分类号 H01L23/373 主分类号 H01L23/373
代理机构 代理人
主权项
地址