发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To simplify the structure of a cap, and to facilitate assembly by a method wherein the inner end section of a lead member is bent in a stepped manner along a recessed section in a case member, and fixed to the base of the recessed section in the case member through a glass material together with a pellet, and a cap member is shaped to a flat tabular form, and sealed to the upper surface of the case member through the glass material. CONSTITUTION:The inner end side 3a of a lead member is welded to the base of a recessed section if a case member at a temperature of approximately 450 deg. through glass 7, and the lead member is welded to the upper surface of the case member through glass 8 at the central section of the lead. A semiconductor pellet 5 to which an EPROM element is shaped is fastened to the base of the recessed section in the case through glass 7 at the same low position as the inner lead 3a. The pellet 5 and the inner leads 3a are wire-bonded by small-gage wires 10 consisting of gold or aluminum under the state. A flat tabular cap member 11 composed of high-purity alumina ceramics, through which ultraviolet rays can be transmitted, or transparent glass is sealed to the upper surface of the ceramic case through glass 8 so as to hold the lead. A frame section in a lead frame is cut off after glass sealing.
申请公布号 JPS61194751(A) 申请公布日期 1986.08.29
申请号 JP19850034347 申请日期 1985.02.25
申请人 HITACHI LTD 发明人 SHOJI SENJI;HOSHI AKIRO;YAMADA TOMIO;OWAKI SEISHIRO;MIYAHARA KIRIO
分类号 H01L23/12;H01L23/10;H01L23/50 主分类号 H01L23/12
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