| 摘要 |
PURPOSE:To appropriately put filling resin into the surface of a substrate by a method wherein molds for sealing a device with resin provided with protrusions on their sides are used with the protrusions functioning to stop or impede the flow of resin, supposed to be present only on one primary surface of the substrate, from reaching the other primary surface after travelling along the sides of a supporting plate. CONSTITUTION:When top and bottom forces 23, 24 are put together, leads 13-15 are held between the two forces 23, 24 and the thin section 12b of a supporting plate 12 is held between upper and lower pins 23a, 24a. A cylindrical protrusion 23b contacts the bottom force 24 through a cutaway 18 provided in the supporting plate 12. A shield-type protrusion 23c is positioned between an resin inlet port 26 and a chip 19. A side protrusion 23d covers a length corresponding to the distance between the shield-type protrusion 23c and the middle of the chip 19, with a very small gap left open between the edge of the side protrusion 23d and the supporting plate 12. With the supporting plate 12 being accommodated between the upper and lower forces 23, 24 so that their positions are correct especially in the direction of the thickness, the distance may be accurately set between the edge of the side protrusion 23d and the supporting plate 12. |
