| 摘要 |
<p>In a microwelding system (ultrasonic or thermocompression) to join conductive wires to many electrodes on a semiconductor chip and electrical leads, a first distance from the top position of a tool located to that electrode is determined in a first stage. In a second stage, a distance smaller than the first or second by a predetermined amount is laid down. In the third stage, the tool is lowered until it reaches the curtailed distance at the first velocity, followed by soldering it as a slower velocity until the wires are joined to electrodes and leads. This creates a highvelocity system of microwelding which can be readily adpated to many differnt workpieces.</p> |
