发明名称 DIE-BONDING METHOD
摘要 PURPOSE:To obtain excellent bonding by elongating a metal piece to a wider area by a method wherein, in bonding an IC pellet on a carrier, the pellet is mounted on a metal tape loaded on the carrier and then scrubbed by means of a pulse motor along a Lissajous's figure produced by the combination of X-directional reciprocating fine movement and Y-directional fine movement. CONSTITUTION:A side frame type ceramic package 3 with a piece 6 of Au or solder tape adhered on the upper surface is mounted on a heat block 1 incorporating a heater 2, and the IC pellet 6 supported by a collet 5 is pressed on the piece 6 and then scrubbed by movements of a bonding arm 7 and the block 1. In other words, the block 1 is placed on a reciprocating table 9 and set first in Y-directional reciprocation by means of a nut 8, a screw 11, and the pulse motor 10. The arm 7 connected to the collet 5 is provided with a pulse motor 14 via cam roller 17, eccentric cam 15, and the like; thereby allowing the collet 5 to generate X-directional reciprocation.
申请公布号 JPS60124944(A) 申请公布日期 1985.07.04
申请号 JP19830232782 申请日期 1983.12.12
申请人 KAIJIYOU DENKI KK 发明人 MIYOSHI HIDEAKI;URAMOTO IWAMI
分类号 H01L21/52;H01L21/58;(IPC1-7):H01L21/58 主分类号 H01L21/52
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