发明名称 |
A semiconductor member and semiconductor device employing such a member. |
摘要 |
<p>A semiconductor member has a structure wherein a first semiconductor layer (31) is located between second and third semiconductor layers (32, 33) which have forbidden band widths greater than a forbidden band width of the first semiconductor layer (31). The second semiconductor layer (33) is between the first semiconductor layer (71) and a substrate and is doped with impurities. The semiconductor member constructs a depletion type device with the first and second semiconductor layers (31, 33), and an enhancement type device with the first and third semiconductor layers (31, 32). A semiconductor device can be formed as an enhancement or depletion type by selectively connecting the semiconductor layers (31, 32, 33).</p> |
申请公布号 |
EP0147196(A2) |
申请公布日期 |
1985.07.03 |
申请号 |
EP19840308978 |
申请日期 |
1984.12.20 |
申请人 |
HITACHI, LTD. |
发明人 |
SAWADE, YASUSHI;UEYANAGI, KIICHI;KATAYAMA, YOSHIFUMI;SHIRAKI, YASUHIRO;MORIOKA, MAKOTO;KURODA, TAKAO;MISHIMA, TOMOYOSHI |
分类号 |
H01L29/812;H01L21/338;H01L21/8252;H01L27/095;H01L29/201;H01L29/205;H01L29/36;H01L29/43;H01L29/47;H01L29/778;H01L29/80;(IPC1-7):H01L29/80;H01L29/207 |
主分类号 |
H01L29/812 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|