发明名称 A semiconductor member and semiconductor device employing such a member.
摘要 <p>A semiconductor member has a structure wherein a first semiconductor layer (31) is located between second and third semiconductor layers (32, 33) which have forbidden band widths greater than a forbidden band width of the first semiconductor layer (31). The second semiconductor layer (33) is between the first semiconductor layer (71) and a substrate and is doped with impurities. The semiconductor member constructs a depletion type device with the first and second semiconductor layers (31, 33), and an enhancement type device with the first and third semiconductor layers (31, 32). A semiconductor device can be formed as an enhancement or depletion type by selectively connecting the semiconductor layers (31, 32, 33).</p>
申请公布号 EP0147196(A2) 申请公布日期 1985.07.03
申请号 EP19840308978 申请日期 1984.12.20
申请人 HITACHI, LTD. 发明人 SAWADE, YASUSHI;UEYANAGI, KIICHI;KATAYAMA, YOSHIFUMI;SHIRAKI, YASUHIRO;MORIOKA, MAKOTO;KURODA, TAKAO;MISHIMA, TOMOYOSHI
分类号 H01L29/812;H01L21/338;H01L21/8252;H01L27/095;H01L29/201;H01L29/205;H01L29/36;H01L29/43;H01L29/47;H01L29/778;H01L29/80;(IPC1-7):H01L29/80;H01L29/207 主分类号 H01L29/812
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