| 摘要 |
PURPOSE:To prevent the corners of a mold part from tipping at the time of cutting tab leads by a method wherein a corner of the mold part intersecting the tab leads is formed in cutout shape. CONSTITUTION:A tab 12 where a semiconductor element is mounted is formed at the center of the frame section of a lead frame. This tab 12 is supported at least at its two corners by the inner ends of the tab leads 13 respectively connected to the frame section 10 of the lead frame. The semiconductor element 11 is fixed to the tab 2 thus formed and molded with resin, and the element 11 is covered with the mold part 17 made of resin. At this time, the corner of the mold part 17 intersecting the leads 13 is molded to the chamfered state having a plane 18 so cut as to rectangularly intersect the leads. This manner enables the corner of the mold part 17 from breaking at the time of cutting the leads 13 at the root of the mold part 17. |
