| 摘要 |
PURPOSE:To miniaturize a semiconductor pellet by dispersing and forming leading-out electrodes to the main surface and side surface of the semiconductor pellet. CONSTITUTION:Leading-out electrodes 11 and formed to a semiconductor pellet 10 extending over a side surface from the main surface of the pellet. One end sections of lead wires 12 are connected to the electrode 11 sections exposed to the side surface. The pellet 10, a pellet mount section, the lead wires 12 and lead electrodes 13 are sealed integrally with a resin seal body 14 so that the end sections of the electrodes 13 are exposed to the outside. According to a semiconductor device 20 constituted in this manner, the pellet 10 can be miniaturized while reducing the area of a main body. Consequently, the device 20 can be miniaturized and manufacturing cost can be reduced even when a large number of the lead wires 12 are lead out of the pellet 10. |
