发明名称 PROCEDE DE FABRICATION D'UNE MINCE PLAQUE DE CUIVRE A CONDUITS D'ECOULEMENT
摘要 A method of manufacturing a thin plate or band from copper or a copper alloy is disclosed, the plate or band having flow conduits parallel to its plane, in which a thicker copper plate billet, which also has flow conduits parallel to its plane and the total wall thickness of which, as measured in a direction perpendicular to the plane of the plate, is equal to the thickness of the plate on both sides of the flow conduit, is cold worked to its final material thickness, whereafter the flow conduit flattened during the rolling is opened by means of pressure produced inside it.
申请公布号 FR2472440(B1) 申请公布日期 1985.06.21
申请号 FR19800027839 申请日期 1980.12.24
申请人 OUTOKUMPU OY 发明人
分类号 B21D53/04;F28F3/14;(IPC1-7):B23P15/26;B21H7/00;B21D53/02 主分类号 B21D53/04
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