| 摘要 |
PURPOSE:To enable to remove bad influences due to static electricity in a semiconductor device having a light-transmitting window and to realize the more highly reliable semiconductor device by a method wherein a conductive thin film consisting of an Al, a metal compound, etc., which is used for electrically connecting to a grounding terminal, is ready coated on the surface of the window. CONSTITUTION:Numerous terminals are protrudedly provided on the back surface of a package substrate 5 and one terminal 3 of the terminals is used as a grounding terminal. A recessed part is formed in the central part of the surface of the substrate 5, a semiconductor pellet 6 is fixed thereon and electrode wires having been provided at the pellet 6 are connected to the lead terminals having been provided on the surface of the substrate 5 using wires 7. A ceramic package cap 1 having a light-transmitting window 2 corresponding to the pellet 6 is adhered on the whole surface of the substrate 5 using a low-melting point glass 8, a conductive thin film 9 consisting of an oxide containing Al, metal compound, tin oxide, etc., is coated on the surface of the window 2, and the conductive thin film 9 is connected to the grounding terminal 3 through a metallized layer 4 having been provided on the surface of the cap 1. |
