| 摘要 |
PURPOSE:To enable fine working direct light and to simplify process by forming a titled material of specific organoladder polysiloxane and bis-silyl compd. and photosensitizer. CONSTITUTION:A titled material is formed of the organoladder polysiloxane obtd. by bringing the organoladder polysiloxane expressed by the formula I which is terminal hydroxylader type organopolysiloxane and the unsatd. compd. expressed by the formula II into reaction in an org. solvent as well as bis-silyl compd. and photosensitizer. The organoladder polysiloxane and the unsatd. compd. are mixed at a ratio of 1-3 alkoxy groups of the unsatd. compd. with one hydroxyl group of the organoladder polysiloxane. Such heat resistant photosensitive material is coated on a silicon wafer or the like and light or radiations are irradiated through a mask having a prescribed pattern thereto, then the material is developed by an arom. hydrocarbon solvent or the like, then the unexposed part is washed away and the relief pattern having a sharp end face is obtd. In the formulas, R1-R3 are lower alkyl groups such as a methyl group and a propyl group, X is a hydrogen atom, methyl group, etc., l is 1-3, n is 2-100. |
