| 摘要 |
PURPOSE:To contrive the reduction of the total exposure time required by reduced projection onto wafers or photomask substrates by providing plural reticle pattern image forming systems inside the device which is so constituted that images of reticle patterns are formed in plural positions of a substance to be exposed such as a wafer respectively by said image forming systems and at the same time, exposure is performed. CONSTITUTION:By reduced paterns PA and PB or reticles 3 and 4 which are projected onto a wafer W, respective reticle patterns 3 and 4 are exposed on the surface of wafer W simultaneously. When the wafer W is moved by 1-chip pitch in X-direction, patterns PA' and PB' are projected next to the above PA and PB and patterns PA' and PB' are similarly exposed at a time. After that, this operation is repeated and after the wafer W is moved by about a size of radius in X-direction, it is moved in Y-direction by 1-chip pitch and next in right-X direction intermittently whereas completing the similar exposure. As a result, a pattern of the reticle 3 is exposed in a right half of the wafer W and a pattern of the reticle 4 is exposed in the left half. Accordingly, exposure of two chips are performed for the wafer W at a time.
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