| 摘要 |
PURPOSE:To obtain high sealing effect by covering the majority of a device with a resin molding which superior sealing effect such as moisture resistance. CONSTITUTION:A capacitor 80 is connected to a lead frame 21, which is then molded. The housing for an integrated circuit 41 and a multielement magnetic head 1 is formed, and the integrated circuit 41 and multielement magnetic head 1 is mounted on the lead frame 21 in the housing, wired mutually, and then molded lastly.
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