| 摘要 |
PURPOSE:To obtan an aluminum laminated cooler which generates less improper components and has a light weight and an inexpensive cost by forming a post by cutting an aluminum rod material on which a solderable metal is coated in the prescribed length, pressing an aluminum plate on which a solderable metal is coated to form cooling fins, and soldering them to form the cooler. CONSTITUTION:An aluminum rod material 1 on which a solderable metal 2 is coated is cut in the prescirbed length to form a post 3. An aluminum plate or strip 4 on at least one side of which a solderable metal 5 is coated is pressed in the prescribed shape as a cooling fin portion 6. The post 3 and the fin portion 6 are bonded by a solder to manufacture a laminated cooler 8. Since both the post and the fin portion are formed of aluminum, they are light and have the same expansion coefficient. Accordingly, the stress of the soldered portion less occurs. Since the bonding surface with a semiconductor element is formed of aluminum, the solder is not bonded to the aluminum oxide film. Consequently, the value of the product does not decrease. Further, when a scratch is formed on the bonding surface of the semiconductor to the post, it can be simply improved by cutting. |
