| 摘要 |
PURPOSE:To contrive to eliminate the need of having previously aligned diode chips by a method wherein the respective characteristics of the diode chips are discriminated at the assembling time of a diode. CONSTITUTION:A lead electrode 12 made to shift from a pallet 36 is put on a conductive jig 20. A vacuum chuck 24 is made to shift to the pallet 36, and the vacuum chuck 24 sucks the face of a diode chip 14 on one side thereof and makes the other face of the chip 14 contact to the electrode 12. Current is made to flow between the jig 20 and the point part 24A of the chuck 24 and the direction of P-N junction of the chip 14 and the reverse withstand voltage are measured. When the result of measurement shows that the chip 14 is not under a condition of prescribed characteristics, the chip 14 is returned to a pallet 34. On the contrary, when the chip 14 was shown to be under the condition of prescribed characteristics, the pressure of the chuck 24 is turned into positive pressure, the chip 14 is released from the point part 24A and the chip 14 is left as the chip 14 has been placed on the electrode 12. The chuck 24 is made to shift to a pallet 32, and the chuck 24 sucks a lead electrode 10 and puts the electrode 10 on the chip 14. The lead electrodes and the diode chips, which have been superposed in such a way, are mutually adhered. |
