| 摘要 |
PURPOSE:To enable the construction of a high-reliability sealing system suitable for production of small quantity of multi-kinds by a method wherein an insulating layer is superposed on a metallic base substrate, which is provided with a circuit pattern on the surface, and a recess is formed. CONSTITUTION:The insulating layer 1a is superposed on the substrate 1 via adhesive layer, and a copper foil 1b is formed on the surface in the circuit pattern by circuit processing. A semiconductor element 4 is adhesion-fixed to the die bonding section 3 arranged in the recess 1c of such a substrate, and is coupled with the bonding section 1b' of the circuit by means of wires 5, and the recess is then filled with sealing resin 6. Or, the semiconductor element is hermetically sealed by covering the element, bonding section 1b', and wires 5 with a metal cap, and by filling the gap formed between the cap and the recess with the resin. This manner enables the sealing structure of high moisture resistance and high reliability without the stress of expansion and contraction of the resin to be obtained. |
