| 摘要 |
<p>PURPOSE:To avoid the application of large stress even under solder-mounting to a lead frame by a method wherein a metallic film for solder mounting is formed to a part of the back. CONSTITUTION:The Au-deposited film for solder mounting is formed not over the whole back of the titled chip 10, but to part of its back. For example, an Ni film 2 is formed by Ni evaporation after the back of an Si substrate 1 is lapped, and a vanadium film 3 is formed by vanadium evaporation. Further, an Au film 4 is formed by Au evaporation. A resist film 5 is applied on this Au film, the resist film 5 formed into a required pattern by photoetching that resist film 5 into the illustrated pattern being made as a mask, and the Au, Vd, and Ni being then plasmaetched. Finally, the resist film is exfoliated, and the Au-deposited film is formed in a pattern of the vertical and transverse arrangement of rectangular form members 11.</p> |
