| 摘要 |
PURPOSE:To facilitate the positioning of a diode chip during assembly and to eliminate the cutting of the connection of both terminals with the chip due to the thermal expansion of a resin after molding by a method wherein the chip is arranged with the projected shape and area equal to the shape and area of the superposition of external terminals. CONSTITUTION:The upper and lower side terminals 1 and 2 adhering the diode chip 3 by sandwiching are arranged with the shape and area of their superposition 5 equal to the projected shape and area of the chip, so that in resin molding the chip may be wrapped with the terminals, and that the molding resin does not interpose between the terminals. This manner enables easy correction of the chip position even when the chip is sandwiched between both terminals, causing no connection break-down between both terminals and the chip due to the thermal expansion of the molding resin. |
