| 摘要 |
<p>A catalyst carrier comprise a substrate made of a material selected from a stainless steel and a nickel base alloy both at least containing 0.2 to 0.8 wt% of Ti and 0.01 to 0.5 wt% of C, and an alumina thin layer firmly bonded onto the surface of the substrate by A l -O-Ti-C bonds, said catalyst carrier being shaped in the form of a porous body having gas permeability in at least one direction. The alumina thin layer may be firmly bonded by A l -O-Ti-C bonds to the surface of the substrate having an aluminum-iron alloy layer or an aluminum-nickel alloy layer. The alumina thin layer is formed by heat treating alumina coated onto the surface of substrate at 600 to 1,000 DEG C for not less than 10 minutes. Instead of the coating with alumina, aluminum may be plated onto the surface of the substrate for this purpose.</p> |
