发明名称 |
Epoxy resin mixture |
摘要 |
A resin mixture for the production of high-temperature-resistant moulded materials, comprising A. 100 parts by weight of an epoxy resin B. From 10 to 150 parts by weight of a curing agent, preferably diaminodiphenyl sulphone. The epoxy resin is a product of the reaction of epichlorohydrin with a polyamine of the formula <IMAGE> where the mean degree of polymerisation n is between 0.2 and 2.0.
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申请公布号 |
DE3340999(A1) |
申请公布日期 |
1985.05.23 |
申请号 |
DE19833340999 |
申请日期 |
1983.11.12 |
申请人 |
BASF AG |
发明人 |
TESCH,HELMUT,DR.;CZAUDERNA,BERNHARD,DR.;HEYM,MANFRED,DR. |
分类号 |
C08G59/10;C08G59/32;(IPC1-7):C08L63/00;C08J5/04 |
主分类号 |
C08G59/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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