发明名称 Epoxy resin mixture
摘要 A resin mixture for the production of high-temperature-resistant moulded materials, comprising A. 100 parts by weight of an epoxy resin B. From 10 to 150 parts by weight of a curing agent, preferably diaminodiphenyl sulphone. The epoxy resin is a product of the reaction of epichlorohydrin with a polyamine of the formula <IMAGE> where the mean degree of polymerisation n is between 0.2 and 2.0.
申请公布号 DE3340999(A1) 申请公布日期 1985.05.23
申请号 DE19833340999 申请日期 1983.11.12
申请人 BASF AG 发明人 TESCH,HELMUT,DR.;CZAUDERNA,BERNHARD,DR.;HEYM,MANFRED,DR.
分类号 C08G59/10;C08G59/32;(IPC1-7):C08L63/00;C08J5/04 主分类号 C08G59/10
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