| 摘要 |
<p>PURPOSE:To improve manufacturing efficiency and to prevent the chip surface from contamination by a method wherein cracking and chip-bonding are systematized. CONSTITUTION:A semiconductor wafer 2 adhered to a seat is separated from the seat by a rod 12a moving up, when N2 is jetted into the chamber from above the wafer 2 through an outlet 12c. The wafer 2 after separation is transported above the separating unit 12 and takes a prescribed position. From this position, chips are picked up one after the other to be connected to a pad 6a of a load- frame 6 by means of a chip bonder. The holder 12d of the seat-clamping means goes up into the separating unit 12 only to accomplish separation. By using a system thus constructed, yield out of the device assembling process, quality and reliability are improved.</p> |
