发明名称 CURING METHOD OF EXPANDED POLYPROPYLENE RESIN MOLDING IN MOLDS
摘要 PURPOSE:To effectively cure an expanded molding with a high dimensional accuracy by a method in which an expanded polypropylene resin molding in molds is cured in a proper curing temperature range according to the densities of the expanded moldings. CONSTITUTION:Expansible grains are packed into molds and heated to form an expanded polypropylene resin molding in which grains are mutually bonded. The expanded polypropylene resin molding is cured at a temperature of 40 deg.C to 2,000d+40 deg.C when the density (d) of the expanded molding is 0.03g/cm<3> or less and also at a temperature of 40-100 deg.C when the density is 0.03g/cm<3> or more. Since the expanded molding is cured at proper temperatures according to the densities, the shrinkage of the molding cn be prevented, the shrinkage after molding can be recovered, and the expanded molding with high dimensional accuracy can be obtained without the needs for heat energy more than necessary and also without troubles with shortage of curing.
申请公布号 JPS6090744(A) 申请公布日期 1985.05.21
申请号 JP19830198707 申请日期 1983.10.24
申请人 NIPPON STYREN PAPER KK 发明人 KUWABARA HIDEKI;SUDOU YOSHIMI
分类号 B29C44/00;B29K23/00;B29K105/04 主分类号 B29C44/00
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