Method of manufacturing printed wiring boards

摘要

A base substrate of a printed wiring board is coated, by wet plating, with metal films over two major surfaces thereof and the inner walls of through-holes formed therein wherein the metal films formed over the inner walls of the through-holes form via-holes for electrically connecting the metal films formed over the two surfaces with each other. In the wet plating, the base substrate is taken out of the plating bath for a first predetermined period of time, to thereby cause disintegration of bubbles on the surfaces of the base substrate and the inner walls of the through-holes therein. Then, the base substrate is again immersed into the plating bath for a second predetermined period of time to resume the formation of the metal films.