Method for making circuit boards with die stamped contact pads and conductive ink circuit patterns

摘要

Printed circuit boards have copper contact pads cut from copper foil and bonded to the circuit board, followed by printing circuit patterns of conductive ink on the board, the pattern connecting with the contact pads. The contact pads are cut from a copper foil strip fed with the circuit board beneath a die. Bonding of the contact pads follows, then printing of the circuit patterns. Boards can be formed from strip material in which case the individual boards are cut from the strip material.