发明名称 RESIN MOLD IC
摘要 PURPOSE:To minimize displacement of tab by the inflowing resin when the resin is supplied by arranging the tab hanging lead in the direction along the diagonal line of resin mold package. CONSTITUTION:The tab hanging leads 16A-16D are provided along the diagonal line direction of package, namely along the line extending the direction forming an obtuse angle for two sides of tab which specifies ang angular portions from the angular part of square tab. Therefore, stability of tabs 14, 14 is excellent and displacement of tab 14 by inflowing resin can be minimized when the resin is supplied. Accordingly, trouble of disconnection of connector can be prevented.
申请公布号 JPS6089950(A) 申请公布日期 1985.05.20
申请号 JP19840192505 申请日期 1984.09.17
申请人 HITACHI SEISAKUSHO KK 发明人 WAKASHIMA YOSHIAKI;INAYOSHI HIDEO;NISHI KUNIHIKO
分类号 H01L23/50;H01L23/28;H01L23/31;H01L23/495 主分类号 H01L23/50
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