| 摘要 |
PURPOSE:To improve both durability and mass productivity of thin film magnetic heads by applying sputtering process onto a wafer through a mask having an opening part and forming a thick protecting film at least above a magnetic pole and its vicinity. CONSTITUTION:A metallic mask 8 is attached close on an element as shown in a figure (a). In this case, a stainless steel or metallic foils of Ti, Mo, etc. are available to the mask material in addition to SUS304. The mask thickness must be smaller than the minimum size of an opening part. In this example, the minimum size is set at about 250mum and therefore the mask thickness is set at 200mum. A photoetching process is applied to produce the mask 8. An alumina film 9 of about 30mum is formed over the mask 8 attached close to the element. Then the mask 8 is removed to obtain a section as shown in a figure (b). The mechanical work is applied to said section as conventional. Thus a thin film magnetic head is obtained. |
