发明名称 MOLDING COMPOUND
摘要 Unfilled, unreinforced polyamide moulding compounds are disclosed which have high rigidity and notched impact strength and are highly fluid in the molten state, containing aliphatic polycarbonate polyurethanes which are substantially unbranched in the carbon chain, prepared from polyhexamethylene carbonate diols and/or mixtures thereof with oligo- or polyalkylene glycols having 4-100 carbon atoms and 1,6-diisocyanatohexane.
申请公布号 JPS6086165(A) 申请公布日期 1985.05.15
申请号 JP19840190759 申请日期 1984.09.13
申请人 BAYER AG 发明人 BORUFUGANGU RIHITAA;HANSUUYOZEFU BUISHIYU;BERUTO BURASATO;YOZEFU MERUTEN;HAINRITSUHI HAUPUTO
分类号 C08L75/06;C08L77/00 主分类号 C08L75/06
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