| 摘要 |
PURPOSE:To obtain the titled resin having reduced friction, useful as a wiring plate, etc., producing a small amount of smear during drill processing, by blending a specific epoxy resin with specified components such as a polyhydric phenol, etc. in a specific ratio. CONSTITUTION:(A) 100pts.wt. epoxy resin (e.g., bisphenol A type epoxy resin, etc.) having 0-0.08 hydroxyl number is blended with (B) 40-80pts.wt. polyhydric phenol (preferably tetrabromobisphenol A), (C) 0.1-20pts.wt. silicone intermediate having 150-300 alkoxy group equivalent, (D) 0.1-20pts.wt. polyethylene glycol, and (E) 0.001-0.1pts.wt. catalyst (e.g., quaternary ammonium salt, etc.), and the blend is heated at 120-200 deg.C, to give the desired resin. |
