发明名称 LOW MELTING VISCOSITY POLYAMIDE MOLDING COMPOSITION
摘要 A thermoplastic moulding compsn. contains (I) 98-70wt.%, w.r.t. (I)+(II), of an at least partially crystalline polyamide, and (II) 2-30% of an aliphatic polycarbonate, unbranched in the C chain. Pref. the polycarbonate has Mn 1000-100,000 (2000-50,000), and is prepd. from a 3-200C aliphatic diol and/or polyether diol. Esp., the polycarbonate is prepd. from 100-1(100-75)wt.% hexane, 1,6-diol and 0-99wt.% of 4-100C oligo- or poly-alkylene glycol. The pref. polycarbonate is polyhexamethylene carbonate or polytetramethylene carbonate.
申请公布号 JPS6081246(A) 申请公布日期 1985.05.09
申请号 JP19840188260 申请日期 1984.09.10
申请人 BAYER AG 发明人 BORUFUGANGU RIHITAA;HANSUUYOZEFU BUISHIYU;BERUTO BURASATSUTO;YOZEFU MERUTEN;HAINRITSUHI HAUPUTO
分类号 C08L69/00;C08L77/00 主分类号 C08L69/00
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