LEAD FRAME AUTOMATIC FEEDING POSITIONING MECHANISM IN SEMICONDUCTOR ELEMENT BONDING APPARATUS

摘要

PURPOSE:To realize application of titled mechanism even when even when frame or shape is changed by detecting location of lands of lead frame, calculating positional displacement between such detected location and center position and correcting the position of lead frame. CONSTITUTION:A position detection circuit 40 detects that the center of land of lead frame lies in which photodiode and then inputs such data to a comparison/ operation circuit 41. The information of photodiode at the center position is stored in the memory circuit 42 and this information is input to the circuit 41 for each output from the circuit 40. The circuit 41 compares and calculates both inputs and inputs a difference information, namely position displacement of pertinent land is to the motor drive circuit 43. The circuit 43 shifts the lead frame as much as such positional difference for correction and also shifts the lead frame up to the bonding position. Thereby large scale replacement of parts for each change of the shape and size of lead frame is no longer necessary.